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Teledyne DALSA 

Teledyne DALSA           

Industrial Vision Solutions               

High Performance | Innovative | Proven | Smart Robust | Cost Effective

  • Teledyne Imaging designs, engineers, and manufactures digital imaging components, software, and sub-systems serving a global marketplace, across dozens of business segments, and hundreds of applications.
  • Our imaging technology begins with the visible spectrum, and extends far beyond it, from deep infrared through extreme UV and all the way to X-ray frequencies.
  • Our products define the top end of performance in the world’s most demanding digital imaging applications.

2D Area Scan Cameras

For Visible Light / NIR Spectrum

  • Teledyne Imaging area scan cameras are based on the industry’s most innovative image sensor technology from manufacturers including Sony®, On Semiconductor® and of course our own Teledyne imagers.
  • Teledyne Imaging area scan cameras offers support for a variety of interfaces, such as GigE Vision (1 to 5 GigE), USB3, Camera Link, Camera Link HS, and CoaXPress, to allow seamless integration with virtually any imaging system.

  • From cost-efficient board level cameras to full-featured high performance cameras, Teledyne Imaging provides a broad and deep area scan camera portfolio to meet the challenges of today’s imaging applications.

Z-Trak: 3D Profile Sensor for In-Line Inspections

  • The Z-Trak™ 3D profile sensors use laser triangulation to deliver high-resolution, real-time height measurements, providing reliable and repeatable results in varying operating conditions.
  • Models handle object widths from 8.5 mm to 1520 mm and height ranges of 4 mm to 1100 mm.
  • All Z-Trak models are factory calibrated and offered with either a blue or red eye-safe laser (Class 2M or 3R) to suit the surface reflectance and operating environment.
  • These GigE Vision compliant lightweight IP67 rated profile sensors support Power-Over-Ethernet (POE) to simplify factory wiring and lower cost.

Z-Trak2

  • The new Z-Trak2 Series ushers in a new era of 3D profile sensors for high-speed 3D applications.
  • These models deliver scan speeds up to 45 kHz combined with a suite of powerful features needed for in-line real-time height measurements for defect detection, identification, and guidance in electronics, semiconductor, automotive and factory automation markets segments.

FEATURES

  • S-Series: 2048 points/profile at 45 kHz using 5GigE interface • V-Series: 2048 points/profile at 10 kHz using 1GigE interface
  • Unified Measurement Space for circular and linear sensor configurations
  • Built-in reflection detection algorithms to handle highly reflective surfaces
  • Multi-Sensor Synchronization using single, low cost setup

 

Xtium™2 Family

Image Acquisition and Processing Boards for PCle Gen3 Platform

  • Designed for industrial and biomedical imaging applications, Teledyne DALSA’s image capture cards deliver industry-leading performance and reliability on Microsoft and Linux platforms.
  • From standard off-the-shelf products for low-cost high-volume applications to semicustom or bespoke models with real-time embedded processing, Teledyne DALSA has a frame grabbers solution for you.
  • Teledyne DALSA is committed to supporting both third party and in-house cameras.
  • This continually growing list of supported cameras includes hundreds of different camera models from a number of major machine vision camera vendors.
  • Teledyne DALSA’s Xtium2 series features PCIe Gen3 x8 platform and supports CoaXPress® 2.x (CXP12) and AIA’s Camera Link HS® (CLHS).
  • The Xtium series features the PCIe Gen2 x4/x8 platform and supports AIA’s Camera Link®, CLHS, and CXP interfaces.

                      

 

CLHS PX8 Series

  • Image Acquisition:7 lanes of 10.3 Gbps; 8.4 GB/s
  • Data Forwarding: 7 lanes of 10.3 Gbps; 8.4 GB/s allows distributed processing
  • Host Transfer: 6.8 GB/s with zero CPU overhead
  • Protocol Efficiency: 64/66-bit encoding delivers 97% efficiency
  • Single Cable: Fiber cable (AOC) delivers longer length at max. camera rate
  • 3 Models to balance price and performance needs

CLHS FX8 Series

  • Multi-Camera Support: 1x4-lane, 2x2-lane, 1x4-lane or 1x2-lane with 2x1-lane
  • SFP+ Industry Standard Interface: Cable length up to 300 m
  • Image Acquisition: 4 CLHS lanes of 10.3 Gbps; 4.8 GB/s
  • Protocol Efficiency: 64/66-bit encoding delivers 97% efficiency
  • Data Forwarding: 2-lanes at max. camera rate allows distributed processing
  • Host Transfer: 6.8 GB/s with zero CPU overhead
  • 2 Models to balance price and performance needs

CXP12 Series 

  • PCI Express Gen3 x8 platform
  • CXP 2.0—supports CXP operations at 12.5, 6.25, 5, 3.125, 2.5 and 1.0 Gbps
  • Image acquisition up to 4.8 GB/s; host transfers up to 6.8 GB/s
  • Multi-Camera Support: 1x4-ch, 2x2-ch, 4x1-ch or 1x2-ch with 2x1-ch
  • Combined operations with CXP ver. 2.x and 1.x cameras
  • Power over CXP (PoCXP)

 

 

 

 

 

 

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